Visual Inspection

External Visual Inspection

External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.  Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.
Visual Inspection is a term used for inspecting electronic components under a microscope to determine if a device has been altered from its original state. During this process a device may show signs of non conformance or inconsistencies that help determine if a device has been used or if a device is new and original. This process is normally performed by a Components Test Lab or Test House for short. This process is a non-destructive and devices can be used afterwards. There are so many things to look for during a visual inspection. Below are some of the things generally looked for during a visual inspection of IC Devices.

Device Markings
  • Inconsistently Printed Device Markings

  • Double Printed Markings

  • Marking Placement

  • Ghost Markings

  • Marking Alignment

  • Font Inconsistently Printed

  • Marking Splatter

  • Marking Orientation

  • Laser Burns

Pin Indicator - COO
  • Texture of Pin Indicator

  • Position of Pin Indicator Comparison

  • Foreign Object Debris Inside Pin

  • Secondary Coating Inside Pin Indicator

  • Different Country of Origin

  • Pin Size and Depth Comparison

Body Inspection
  • Sanding Marks

  • Secondary Coating

  • Pull Marks

  • Tool Marks

  • Flaking

  • Scratches

  • Molding Texture

  • Foreign or Displaced Material

  • Contamination

  • Mold Mark

  • Mold Flash

  • Corrosion

  • Cracks

  • Chips

  • Over spray

  • Inconsistent Textures

  • Voids

Solder Mask
  • Solder Mask Damage

  • Foreign or Displaced Material

  • Residue on Soldermask

  • Soldermask Scratches

Bga Condition
  • Solder Mask Damage

  • Foreign or Displaced Material

  • Residue on Soldermask

  • Soldermask Scratches

Package Condition
  • Physical Dimensions

  • Package Construction

  • Construction Defects

Lead Condition
  • Oxidation

  • Re-Tinned

  • Straightened

  • Refurbished

  • Bent Leads

  • Tool Marks

  • Lead Plating Quality

  • Lead Alignment

  • Lead Formation

  • Scratches on Leads

  • Scoring

  • Voids

  • Plating Composition

  • Physical Dimensions

  • Residue

  • Distorted

  • Corrosion

  • Chips in Leads

  • Excess Solder Material

  • Exposure to High Temperatures